专利名称：Device and method for concentrically
releasing a semiconductor wafer from acarrier substrate using a film frame
发明人：LINDNER, FRIEDRICH PAUL,BURGGRAF,
JÜRGEN
申请号：EP13195920.7申请日：20090901公开号：EP2706561A3公开日：20140903
专利附图：
摘要：The device is provided with a film with an adhesive layer (3s) to accommodate
the product substrate in a contacting surface section (3k) of the film. The film is mountedin a mounting section (3b) encasing the contacting surface section. A separating section(3a) is placed between the contacting surface section and the mounting section. Anindependent claim is also included for a method for separating a product substrate froma carrier substrate.
申请人：EV GROUP GMBH
地址：DI Erich Thallner Strasse 1 4782 St. Florian am Inn AT
国籍：AT
代理机构：Schweiger, Johannes
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