METHOD FOR MANUFACTURING WIRING SUBSTRATE

专利名称：METHOD FOR MANUFACTURING WIRING

SUBSTRATE

发明人：YAMAMOTO, Hisamitsu,KAWASE,

Tomohiro,TAKEUCHI, Masaharu

申请号：EP15842761.7申请日：20150914公开号：EP3196339B1公开日：20190828

摘要：Disclosed herein is a method for fabricating a wiring board in which a targetsubstrate having via holes and/or trenches is subjected to an electroless plating processwhile being immersed in an electroless plating solution to fill the via holes and/or thetrenches with a plating metal. The method includes the steps of: supplying the

electroless plating solution to under the target substrate; diffusing an oxygen-containinggas into the electroless plating solution supplied under the target substrate; andallowing the electroless plating solution to overflow from over the target substrate.

代理机构：Delorme, Nicolas

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