专利名称：Method for molding thermoplastic resin发明人：Yamaki, Hiroshi,Matsuura,
Yoshimasa,Kataoka, Hiroshi
申请号：EP97306619.4申请日：19970829公开号：EP0826477A3公开日：20000412
摘要：A method for molding a thermoplastic resin by filling a molten thermoplasticresin into a mold which comprises carrying out the molding of the resin while reducingthe solidification temperature of the resin surface which contacts with the mold duringthe step of filling the resin. To this effect, a gas which has a high solubility in the resin ispresent in the mold cavity and is absorbed in the resin surface, thereby reducing itssolidification temperature. According to this molding method, the state of the moldsurface can be faithfully transferred to molded articles.
申请人：Asahi Kasei Kogyo Kabushiki Kaisha
地址：2-6, Dojimahama 1-chome, Kita-ku Osaka-shi, Osaka 530-8205 JP
国籍：JP
代理机构：BROOKES & MARTIN
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