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MC74VHCT573AD,规格书,Datasheet 资料

2024-01-28 来源:步旅网
MC74VHCT573AOctal D-Type Latchwith 3-State Output

The MC74VHCT573A is an advanced high speed CMOS octal latchwith 3−state output fabricated with silicon gate CMOS technology. Itachieves high speed operation similar to equivalent Bipolar SchottkyTTL while maintaining CMOS low power dissipation.

This 8−bit D−type latch is controlled by a latch enable input and anoutput enable input. When the output enable input is high, the eightoutputs are in a high impedance state.

The VHCT inputs are compatible with TTL levels. This device canbe used as a level converter for interfacing 3.3 V to 5.0 V, because ithas full 5.0 V CMOS level output swings.

The VHCT573A input and output (when disabled) structuresprovide protection when voltages between 0 V and 5.5 V are applied,regardless of the supply voltage. These input and output structureshelp prevent device destruction caused by supplyvoltage−input/output voltage mismatch, battery backup, hot insertion,etc.

Features

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MARKINGDIAGRAMS

20VHCT573AAWLYYWWG1

1SOIC−20WBSUFFIX DWCASE 751D

••••••••••••

20

VHCT573AALYWGG1

High Speed: tPD = 7.7 ns (Typ) at VCC = 5.0 V

Low Power Dissipation: ICC = 4 mA (Max) at TA = 25°CTTL−Compatible Inputs: VIL = 0.8 V; VIH = 2.0 V

Power Down Protection Provided on Inputs and OutputsBalanced Propagation Delays

Designed for 4.5 V to 5.5 V Operating RangeLow Noise: VOLP = 1.6 V (Max)

Pin and Function Compatible with Other Standard Logic FamiliesLatchup Performance Exceeds 300 mAESD Performance:

Human Body Model > 2000 V;Machine Model > 200 V

Chip Complexity: 234 FETs or 58.5 Equivalent GatesThese Devices are Pb−Free and are RoHS Compliant

1TSSOP−20SUFFIX DTCASE 948E

A=Assembly LocationWL, L=Wafer LotYY, Y=Year

WW, W=Work WeekG or G= Pb−Free Package

(Note: Microdot may be in either location)

FUNCTION TABLE

INPUTSOELLLHLEHHLXDHLXXOUTPUTQHLNo ChangeZORDERING INFORMATION

See detailed ordering and shipping information in the packagedimensions section on page 4 of this data sheet.

© Semiconductor Components Industries, LLC, 2011

June, 2011 − Rev. 5

1

Publication Order Number:

MC74VHCT573A/D

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MC74VHCT573A

D0D1D2

DATAINPUTS

D3D4D5D6D7LEOE234567891111918171615141312Q0Q1Q2Q3Q4Q5Q6Q7NONINVERTINGOUTPUTS

OED0D1D2D3D4D5D6D7GND

1234567891020191817161514131211VCCQ0Q1Q2Q3Q4Q5Q6Q7LE

Figure 1. Logic Diagram

Figure 2. Pin Assignment

MAXIMUM RATINGS

SymbolVCCVinVoutIIK

DC Supply VoltageDC Input VoltageDC Output VoltageInput Diode Current

ParameterValue– 0.5 to + 7.0– 0.5 to + 7.0

Outputs in 3−StateHigh or Low State

– 0.5 to + 7.0– 0.5 to VCC + 0.5

− 20±20±25±75500450

UnitVVVmAmAmAmA

IOKIoutPD

Output Diode Current (VOUT < GND; VOUT > VCC)DC Output Current, per Pin

DC Supply Current, VCC and GND PinsPower Dissipation in Still Air,Storage Temperature

ICC

SOIC Package†

TSSOP Package†

mW_C

This device contains protectioncircuitry to guard against damagedue to high static voltages or electricfields. However, precautions mustbe taken to avoid applications of anyvoltage higher than maximum ratedvoltages to this high−impedance cir-cuit. For proper operation, Vin andVout should be constrained to therange GND v (Vin or Vout) v VCC.Unused inputs must always betied to an appropriate logic voltagelevel (e.g., either GND or VCC).Unused outputs must be left open.

Tstg

– 65 to + 150

Maximum ratings are those values beyond which device damage can occur. Maximum ratings

applied to the device are individual stress limit values (not normal operating conditions) and arenot valid simultaneously. If these limits are exceeded, device functional operation is not implied,damage may occur and reliability may be affected.

†Derating−SOIC Packages: – 7 mW/_C from 65_ to 125_C

TSSOP Package: − 6.1 mW/_C from 65_ to 125_C

RECOMMENDED OPERATING CONDITIONS

SymbolVCCVinVoutTA

ParameterMin4.500

0

Max5.55.5

UnitVVV

DC Supply VoltageDC Input Voltage

DC Output Voltage

Outputs in 3−State

High or Low State

5.5VCC

Operating Temperature− 400

+ 8520

_C

tr, tfInput Rise and Fall TimeVCC =5.0V ±0.5V

ns/V

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MC74VHCT573A

DC ELECTRICAL CHARACTERISTICS

SymbolVIHVILVOHVOLIinIOZICC

Parameter

Test Conditions

VCC

V

TA = 25°CTyp

TA = − 40 to 85°CMin2.0

Max0.8

4.43.80

Min2.0

Max0.8

UnitVVV

Minimum High−Level Input VoltageMaximum Low−Level Input VoltageMinimum High−Level Output

VoltageVin = VIH or VIL

IOH = − 50mAIOH = − 8mAIOL = 50mAIOL = 8mAVin = 5.5 V or GNDVin = VIL or VIH

Vout = VCC or GNDVin = VCC or GND

4.5 to 5.54.5 to 5.54.54.54.54.50 to 5.55.55.55.50

4.43.94

4.5

Maximum Low−Level Output

VoltageVin = VIH or VIL

0.00.10.36±0.1± 0.254.0

0.10.44±1.0± 2.540.01.505.0

V

Maximum Input Leakage CurrentMaximum 3−State Leakage CurrentMaximum Quiescent Supply CurrentQuiescent Supply CurrentOutput Leakage Current

mAmAmA

ICCT

Per Input: VIN = 3.4V

Other Input: VCC or GNDVOUT = 5.5V

1.350.5

mAmA

IOPD

AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0ns)

TA = 25°CTyp7.7

8.55.15.96.37.18.8

TA = − 40 to 85°CMin1.01.01.01.01.01.01.0

Max13.514.5

SymboltPLH,

tPHLtPLH,tPHLtPZL,tPZHtPLZ,tPHZ

ParameterTest ConditionsMinMaxUnitnsnsnsnsnspFpF

Maximum Propagation Delay,

LE to Q

Maximum Propagation Delay, D to Q

Output Enable Time, OE to QVCC = 5.0 ± 0.5VVCC = 5.0 ± 0.5V

CL = 15pFCL = 50pFCL = 15pFCL = 50pFCL = 15pFCL = 50pFCL = 50pFCL = 50pF

12.313.38.59.5

9.5

10.5

VCC = 5.0 ± 0.5V

RL = 1kWVCC = 5.0 ± 0.5VRL = 1kWVCC = 5.5 ± 0.5V(Note 1)

10.911.911.21.0

12.513.512.01.010

Output Disable Time,

OE to QtOSLH,

tOSHLCin

Output to Output SkewMaximum Input Capacitance

46

10

Cout

Maximum 3−State Output Capacitance

(Output in High−Impedance State)

Typical @ 25°C, VCC = 5.0V

CPD

Power Dissipation Capacitance (Note 2)

25

pF

1.Parameter guaranteed by design. tOSLH = |tPLHm − tPLHn|, tOSHL = |tPHLm − tPHLn|.

2.CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.Average operating current can be obtained by the equation: ICC(OPR) = CPD 󰀂 VCC 󰀂 fin + ICC/8 (per latch). CPD is used to determine theno−load dynamic power consumption; PD = CPD 󰀂 VCC2 󰀂 fin + ICC 󰀂 VCC.

NOISE CHARACTERISTICS (Input tr = tf = 3.0ns, CL = 50 pF, VCC = 5.0V)

TA = 25°C

SymbolVOLPVOLVVIHDVILD

Quiet Output Maximum Dynamic VOLQuiet Output Minimum Dynamic VOLMinimum High Level Dynamic Input VoltageMaximum Low Level Dynamic Input Voltage

Parameter

Typ1.2−1.2

Max1.6−1.62.00.8

UnitVVVV

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MC74VHCT573A

TIMING REQUIREMENTS (Input tr = tf = 3.0ns)

TA = 25°C

Symboltw(h)tsuth

Parameter

Minimum Pulse Width, LEMinimum Setup Time, D to LEMinimum Hold Time, D to LE

Test ConditionsVCC = 5.0 ±0.5VVCC = 5.0 ± 0.5VVCC = 5.0 ± 0.5V

Typ

Limit6.51.53.5

TA = − 40 to 85°C

Limit8.51.53.5

Unitnsnsns

ORDERING INFORMATION

Device

MC74VHCT573ADWGMC74VHCT573ADWRGMC74VHCT573ADTGMC74VHCT573ADTRG

PackageSOIC−20WB(Pb−Free)SOIC−20WB(Pb−Free)TSSOP−20*TSSOP−20*

Shipping†38 Units / Rail1000 / Tape & Reel75 Units / Rail2500 / Tape & Reel

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel PackagingSpecifications Brochure, BRD8011/D.*This package is inherently Pb−Free.

tw3V

D

tPLHQ

1.5V1.5VtPHLGNDVOHVOL

Q

1.5VLE

1.5V3VGND

tPLHtPHLVOHVOL

Figure 3. Switching WaveformFigure 4. Switching Waveform

3V

OE1.5VtPZLQ

1.5VtPZHQ

1.5VtPHZtPLZGNDHIGH

IMPEDANCE

VOL +0.3VVOH -0.3VHIGH

IMPEDANCE

LE

1.5VGND

D

1.5VtsuthGND3V

VALID3V

Figure 5. Switching WaveformFigure 6. Switching Waveform

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MC74VHCT573A

TEST POINTOUTPUTDEVICEUNDERTESTCL*

DEVICEUNDERTESTTEST POINTOUTPUT1 kWCONNECT TO VCC WHENTESTING tPLZ AND tPZL.CONNECT TO GND WHENTESTING tPHZ AND tPZH.

CL**Includes all probe and jig capacitance

*Includes all probe and jig capacitance

Figure 7. Test CircuitFigure 8. Test Circuit

D0

2DLEQ19Q0

D1

3DLEQ18Q1

D2

4DLEQ17Q2

D3

5DLEQ16Q3

D4

6DLEQ15Q4

D5

7DLEQ14Q5

D6

8DLEQ13Q6

D7

9DLEQ12Q7

LE11OE1Figure 9. Expanded Logic Diagram

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MC74VHCT573A

PACKAGE DIMENSIONS

TSSOP−20CASE 948E−02ISSUE C

20X REFK0.15 (0.006)TUS0.10 (0.004)MTUSVSKK12XL/22011JJ1B−U−NLSECTION N−N0.25 (0.010)MPIN 1IDENT1100.15 (0.006)TUSA−V−NFDETAIL E

CD0.100 (0.004)−T−SEATINGPLANEGHDETAIL ENOTES:

1.DIMENSIONING AND TOLERANCING PERANSI Y14.5M, 1982.

2.CONTROLLING DIMENSION:MILLIMETER.

3.DIMENSION A DOES NOT INCLUDEMOLD FLASH, PROTRUSIONS OR GATEBURRS. MOLD FLASH OR GATE BURRSSHALL NOT EXCEED 0.15 (0.006) PER SIDE.4.DIMENSION B DOES NOT INCLUDEINTERLEAD FLASH OR PROTRUSION.INTERLEAD FLASH OR PROTRUSION

SHALL NOT EXCEED 0.25 (0.010) PER SIDE.5.DIMENSION K DOES NOT INCLUDEDAMBAR PROTRUSION. ALLOWABLEDAMBAR PROTRUSION SHALL BE 0.08(0.003) TOTAL IN EXCESS OF THE KDIMENSION AT MAXIMUM MATERIALCONDITION.

6.TERMINAL NUMBERS ARE SHOWN FORREFERENCE ONLY.

7.DIMENSION A AND B ARE TO BEDETERMINED AT DATUM PLANE −W−.

MILLIMETERSINCHESDIMMINMAXMINMAXA6.406.600.2520.260B4.304.500.1690.177C1.200.047------D0.050.150.0020.006F0.500.750.0200.030G0.65 BSC0.026 BSC−W−H0.270.370.0110.015J0.090.200.0040.008J10.090.160.0040.006K0.190.300.0070.012K10.190.250.0070.010L6.40 BSC0.252 BSCM0 8 0 8 ____SOLDERING FOOTPRINT

7.0610.65PITCH

0.36

16X

16X1.26DIMENSIONS: MILLIMETERShttp://onsemi.com

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MC74VHCT573A

PACKAGE DIMENSIONS

SOIC−20 WBDW SUFFIXCASE 751D−05ISSUE G

DA11X 45_qHMBM2010X0.25ENOTES:

1.DIMENSIONS ARE IN MILLIMETERS.

2.INTERPRET DIMENSIONS AND TOLERANCESPER ASME Y14.5M, 1994.

3.DIMENSIONS D AND E DO NOT INCLUDE MOLDPROTRUSION.

4.MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.5.DIMENSION B DOES NOT INCLUDE DAMBARPROTRUSION. ALLOWABLE PROTRUSIONSHALL BE 0.13 TOTAL IN EXCESS OF BDIMENSION AT MAXIMUM MATERIALCONDITION.

DIMAA1BCDEeHhLqMILLIMETERSMINMAX2.352.650.100.250.350.490.230.3212.6512.957.407.601.27 BSC10.0510.550.250.750.500.900 7 __11020XB0.25

MBTA

SB

SAeSEATINGPLANEh18XA1TCON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further noticeto any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liabilityarising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. Alloperating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rightsnor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applicationsintended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. ShouldBuyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or deathassociated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an EqualOpportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

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